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Place of origin:
China
heat stability. The company's current very low profile copper foil specifications are mainly 9μm, 12μm and 18μm. The copper foil have uniform thickness and fine micro-crystal structure, which can be widely used in HDI, FPC, PCB, CCL, FCCL and other fields.Yancheng Tiandi Insulation Co.,Ltd. https://www.polyimide-pi.com/polyimide-film-based-fccl.htmTel :+86-139-61986280 Fax : +86-515-69011600
[Related Keywords : Very Low Profile Copper, Profile Copper Film HVLP, Hvlp Copper Foil, Low Profile Copper Foil]
Business Type
Manufacturer
Location
江苏, China
Employees Total
51 - 100
Annual Revenue
USD 5,000,001 - 10,000,0000
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