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Min. Order:
Negotiation
Place of origin:
Korea
Price Condition:
FOB
Supply Ability:
Buyers request
Standard Systems provide semiconductor packaging services to assemble die in wafer form to various package types :BGA,QFP,SO,QFN,PLCC, SOIC, PDIP, Etc...... Willing to work for Fabless and IC Design companies can meet your budget and size objectives with our services. Small quantity including Prototype of packages will be solved by our assitance. If have a question, Please contact me. Best Regard
[Related Keywords : Microelectronics, Microcomponents, IC Package Assembly, Multi-chip package]
Business Type
Manufacturer
Location
Seoul, Korea
Employees Total
1 - 5
Annual Revenue
USD 1,000,001 - 2,000,000
Competitive multi-chip package products from various multi-chip package manufacturers and multi-chip package suppliers are listed above, please select quality and cheap items for you.
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