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  • Capacitive Fingerprint Module On the Back of the Phone

    • Min. Order:  

      1000 Piece

    • Price:  

      US$ 1.13

    • Place of origin:  

      China

    Structure: Coating Package size: 10 thickness 0.65mm Induction type: capacitance principle press type Sensing area: 6.0*6.0 Cold screen unlock: <0.15S Pixel array: 120*120 Dividing rate: 508DPI FRRFAR FRR: <2% FAR: <0.002% Power consumption: black screen standby <250u6 Surface hardness: 3H Number of presses: 1 million times Function: Unlock/Wake up when closing the screen Minimum module size: 13*

    [Related Keywords : Fingerprint Module On the]

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