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Min. Order:
10 Piece
Price:
US$ 1
Place of origin:
United States
Supply Ability:
10000pcs/Month
BERGQUIST GPHC3.0,GAP PAD HC 3.0,GAP PAD TGP HC3000 BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K.The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and lowmodulus resin formulation. The enhanced material is ideal for applications requiringlow stress on components and b
[Related Keywords : GAP PAD TGP HC3000, GAP PAD HC 3.0, BERGQUIST GPHC3.0]
Business Type
Manufacturer
Location
Guangdong, China
Employees Total
51 - 100
Annual Revenue
USD 500,001 - 1,000,000
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