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Place of origin:
China
TFUER-T315 * Solder Pallet Materials T315 is a high-performance composite material commonly used as a solder pallet in printed circuit board (PCB) manufacturing processes. It is made of a blend of thermoset epoxy resin and glass fiber fabric, which gives it excellent mechanical strength, thermal stability, and chemical resistance. Key Features 1. Thermal Resistance: T315 can withstand high temper
[Related Keywords : solder pallet materials]
Business Type
Supplier
Location
Jiangxi, China
Employees Total
1 - 5
Annual Revenue
Less than USD 100,000
Min. Order:
10 Piece
Price:
US$ 1
Place of origin:
United States
Supply Ability:
10000PCS/MONTH
Heat sink onto BGA graphic processor• Heat sink onto drive processor• Heat spreader onto powerconverter PCB• Heat spreader onto motor control PCBBERGQUIST BP660P Configurations Available:• Roll form and die-cut partsThe material as delivered willinclude a continuous base liner withdifferential release properties to allowfor simplicity in roll packaging andapplication assembly.
[Related Keywords : Bergquist BP660P, Bond-ply Tbp 400p, BOND-PLY 660P]
Business Type
Manufacturer
Location
Guangdong, China
Employees Total
51 - 100
Annual Revenue
USD 500,001 - 1,000,000
Competitive insulating material pcb products from various insulating material pcb manufacturers and insulating material pcb suppliers are listed above, please select quality and cheap items for you.
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