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Min. Order:
1 Set
Price:
US$ 900000
Place of origin:
China
slice of semiconductor material. This is done using a process called photolithography, where the design is etched onto the wafer. Dicing: Once the wafer has been fabricated, it is cut into individual chips. This process is known as dicing. Packaging: The individual chips are then packaged to protect them from physical damage and environmental factors. This involves placing the chip in a protectiv
[Related Keywords : smart card manufacturing]
Business Type
Manufacturer
Location
Liaoning, China
Employees Total
101 - 500
Annual Revenue
Less than USD 100,000
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