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Min. Order:
100 Piece
Price:
US$ 10000
Place of origin:
China
soldering. When plugging and unplugging chips in DIP packages from the chip socket, special care should be taken to avoid damage to the pins. DIP package structures include: multi-layer ceramic dual in-line DIP, single-layer ceramic dual in-line DIP, lead frame DIP (including glass ceramic sealing type, plastic encapsulation structure type, ceramic low-melting glass encapsulation type) wait.
[Related Keywords : Dual In-line Package]
Business Type
Manufacturer
Location
Guangdong, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
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