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Min. Order:
100 Piece
Price:
US$ 10000
Place of origin:
China
IC functions and the number of I/O pins gradually increased, Intel took the lead in adopting the QFP packaging method in 1997. It has been updated to BGA (Ball Grid Array) packaging. In addition, the recent mainstream packaging methods include CSP (Chip Scale Package) and Flip Chip (flip chip). From 1968 to 1969, Philips developed the Small Outline Package (SOP). Later, SOJ (J-pin small outline p
[Related Keywords : Small Out-Line Package]
Business Type
Manufacturer
Location
Guangdong, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Competitive microprocessor ic products from various microprocessor ic manufacturers and microprocessor ic suppliers are listed above, please select quality and cheap items for you.
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