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Min. Order:
100 Piece
Price:
US$ 10000
Place of origin:
China
Scale Package) and Flip Chip (flip chip). From 1968 to 1969, Philips developed the Small Outline Package (SOP). Later, SOJ (J-pin small outline package), TSOP (thin small outline package), VSOP (very small outline package), SSOP (shrink SOP), TSSOP (thin shrunk SOP) and SOT (small outline package) were gradually derived. Outline Transistor), SOIC (Small Outline Integrated Circuit), etc. Small out
[Related Keywords : Small Out-Line Package]
Business Type
Manufacturer
Location
Guangdong, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Place of origin:
China
Product DescriptionPrecision Automotive NTC Thermistor Suppliers Light Weight Miniature Designed Features 1. Small body diameter of max. 2.0 mm 2. FEP, PFA Insulated lead Wires. 2. Precise measurement in extreme environments. 3. Rapid time response. 4. Thermally Conductive Epoxy Coating. 5. Engineered to withstand extreme temperatures -40 to + 150°C. 6. Greater engineering efficiency due to lin
[Related Keywords : Precision NTC Thermistor]
Business Type
Manufacturer
Location
Anhui, China
Employees Total
101 - 500
Annual Revenue
USD 1,000,001 - 2,000,000
Competitive miniature scale products from various miniature scale manufacturers and miniature scale suppliers are listed above, please select quality and cheap items for you.
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