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Min. Order:
100 Set
Price:
US$ 300
Place of origin:
China
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's l
[Related Keywords : BGA PCB Assembly]
Business Type
Manufacturer
Location
Guangdong, China
Employees Total
51 - 100
Annual Revenue
USD 2,000,001 - 5,000,000
Place of origin:
Taiwan
Dual-in-line: flatpack, SOIC, SOJ, TSOP, SSOP, TSSOP, QSOP, VSOP, DFN Quad-in-line: PLCC, QFP, LQFP, PQFP, CQFP, MQFP, TQFP, QFN, LCC, MLP, PQFN Grid arrays: PGA, BGA, LGA, FBGA, LFBGA, TFBGA, CGA, CCGA, μBGA, LLP Drying and storage of multi-layer PCB and PWB before and after mounting, including dual side boards awaiting second side reflow. Moisture controlled storage with drying/desiccating
[Related Keywords : baking over, n2 purge, desiccator, desiccant]
Business Type
Manufacturer
Location
Taiwan, Taiwan
Employees Total
11 - 50
Annual Revenue
USD 10,000,001 - 50,000,000
Competitive dual line array products from various dual line array manufacturers and dual line array suppliers are listed above, please select quality and cheap items for you.
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