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Place of origin:
China
Description: COIN series uncooled thermal module integrates the wafer-level package detector produced by GST, ASIC chip for imaging processing, micro-motion electromagnetic threshold shutter and general optical interface. It provides complete imaging processing algorithms and abundant external interfaces, which is suitable for the rapid integration of any infrared thermal imaging cameras. Featu
[Related Keywords : Thermal imaging, Infrared sensor, Wafer-Level Package, Uncooled]
Business Type
Manufacturer
Location
Hubei, China
Employees Total
101 - 500
Annual Revenue
USD 5,000,001 - 10,000,0000
Competitive wafer level package products from various wafer level package manufacturers and wafer level package suppliers are listed above, please select quality and cheap items for you.
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