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Place of origin:
Taiwan
packages such as: Dual-in-line: flatpack, SOIC, SOJ, TSOP, SSOP, TSSOP, QSOP, VSOP, DFN Quad-in-line: PLCC, QFP, LQFP, PQFP, CQFP, MQFP, TQFP, QFN, LCC, MLP, PQFN Grid arrays: PGA, BGA, LGA, FBGA, LFBGA, TFBGA, CGA, CCGA, μBGA, LLP Drying and storage of multi-layer PCB and PWB before and after mounting, including dual side boards awaiting second side reflow. Moisture controlled storage with d
[Related Keywords : baking over, n2 purge, desiccator, desiccant]
Business Type
Manufacturer
Location
Taiwan, Taiwan
Employees Total
11 - 50
Annual Revenue
USD 10,000,001 - 50,000,000
Competitive dual in line package products from various dual in line package manufacturers and dual in line package suppliers are listed above, please select quality and cheap items for you.
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