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Place of origin:
Taiwan
line: flatpack, SOIC, SOJ, TSOP, SSOP, TSSOP, QSOP, VSOP, DFN Quad-in-line: PLCC, QFP, LQFP, PQFP, CQFP, MQFP, TQFP, QFN, LCC, MLP, PQFN Grid arrays: PGA, BGA, LGA, FBGA, LFBGA, TFBGA, CGA, CCGA, μBGA, LLP Drying and storage of multi-layer PCB and PWB before and after mounting, including dual side boards awaiting second side reflow. Moisture controlled storage with drying/desiccating capabili
[Related Keywords : baking over, n2 purge, desiccator, desiccant]
Business Type
Manufacturer
Location
Taiwan, Taiwan
Employees Total
11 - 50
Annual Revenue
USD 10,000,001 - 50,000,000
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