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Place of origin:
Taiwan
components and PCBs during high temperature reflow process. When absorbed moisture rapidly expand from high temperatures, common internal component damages and failures such as micro-cracking, blistering, popcorn effects will occur in moisture sensitive devices, packages and components. Printed Circuit Boards are hygroscopic. Absorbed moisture will lead to delamination in PCB when moisture insid
[Related Keywords : baking over, n2 purge, desiccator, desiccant]
Business Type
Manufacturer
Location
Taiwan, Taiwan
Employees Total
11 - 50
Annual Revenue
USD 10,000,001 - 50,000,000
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