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Place of origin:
Taiwan
It is mainly used for the modification of Bismaleimide (BMI), which can greatly reduce the application cost of BMI resin and improve the handleability and processability of BMI resin. Improve the toughness and heat resistance of BMI resin and moldability. Can be used for: 1 electrical insulation materials, copper-clad circuit boards, high temperature impregnating varnish, insulating varnish lamin
[Related Keywords : DABPA, ODABPA, Di-Allyl-Bisphenol-A, Cas No 1745-89-7]
Business Type
Supplier
Location
New Taipei City, Taiwan
Employees Total
6 - 10
Annual Revenue
USD 2,000,001 - 5,000,000
Place of origin:
Taiwan
Price Condition:
FOB
Key Features*Layers: Single-sided, 2L *Finished Board Thickness: 1.0+/-0.1mm *Material:Aluminum_Base Copper_clad_Laminate *Surface Finish: Organic Solderability Preservatives *Copper: 1/1 OZ *Dielectric Layer: *Solder Mask: Taiyo PSR-4000 WT03 (White) *Dielectric Layer Thickness: 80~100 um *Breakdown Voltage: Minimum 750 V/mil *Panel Size: 57mmX239mm
[Related Keywords : MCPCB]
Business Type
Manufacturer
Location
Taoyuan County, Taiwan
Employees Total
Above 1000
Annual Revenue
More than 100,000,000
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