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Min. Order:
10 Piece
Price:
US$ 1
Place of origin:
United States
Supply Ability:
10000PCS/MONTH
BERGQUIST BOND-PLY 660P Typical Applications Include:• Heat sink onto BGA graphic processor• Heat sink onto drive processor• Heat spreader onto powerconverter PCB• Heat spreader onto motor control PCBBERGQUIST BP660P Configurations Available:• Roll form and die-cut partsThe material as delivered willinclude a continuous base liner withdifferential release properties to allowfor simplici
[Related Keywords : Bergquist BP660P, Bond-ply Tbp 400p, BOND-PLY 660P]
Business Type
Manufacturer
Location
Guangdong, China
Employees Total
51 - 100
Annual Revenue
USD 500,001 - 1,000,000
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