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Bga Substrate Wholesale

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Multilayer PCB (3)
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Electronic Products & Components Processing (1)
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bga substrate bga substrate : 11 Products found from 6 Suppliers & Manufacturers

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Alumina Ceramic Circuit Board OEM Motherboard Aluminum Nitride Board Circuit-Board Professional Manu
- Min. Order:
  100 Pack
- Price:
  US$ 4~6
- Place of origin:
  China
BGA repair and reballing 6. ICT, Constant Temperature Burn-in and Function Test 7. Stencil,Cables and Enclosure building 8. Standard Packing and On time Delivery Main Products The above are the main products we recommend for you. We have many other products that are not shown here. If you have any needs, you can also click the link below to get more information.Aluminum Substrate PCA Ceramic Cir

[Related Keywords : Ceramic Circuit Board, Ceramic pcb, PCB Board, LED PCB]
- Kunshan SNC Circuit Tech Co Ltd.
- Business Type
  Manufacturer
- Location
  Jiangsu, China
- Employees Total
  51 - 100
- Annual Revenue
  USD 500,001 - 1,000,000
Contact Now Start Order
5 related Products from this Supplier
Artificial Intelligence PCBA
- Place of origin:
  China
workshop 01005 SMD components, 0.2mm BGA placement capacity and quality control capabilities are very mature. With 12 temperature zone nitrogen reflow furnace, the reflow soldering can be compatible with different PCB thickness (0.5mm ~ 3.2mm) and material (paper substrate, glass fiber substrate, synthetic fiber substrate, non-woven substrate, composite substrate, PFC board) .

[Related Keywords : PCBA, PCB design, iMES Cloud System]
- Shenzhen Mintec Electronics Co., Ltd
- Business Type
  Manufacturer
- Location
  Guangdong, China
- Employees Total
  101 - 500
- Annual Revenue
  USD 2,000,001 - 5,000,000
Contact Now Start Order
Double-Sided PCB Other New Energy PCB PCBA Board Printed Circuit Boards Assembly
- Min. Order:
  1 Piece
- Price:
  US$ 2
- Place of origin:
  China
- Supply Ability:
  60,000 Piece/ per Month
substrate is separated between the layers. After each layer of the circuit is printed, each layer of the circuit is overlapped by pressing. After drilling, the electrical connection between them is usually achieved through plated through holes on the cross section of the circuit board. Multilayer PCB or multilayer printed circuit boards are circuit boards composed of two or more conductive layers

[Related Keywords : Double-Sided PCB, PCB, New Energy PCB, PCBA]
- Ucreate PCB CO LTD
- Business Type
  Manufacturer
- Location
  Guangdong, China
- Employees Total
  101 - 500
- Annual Revenue
  USD 50,000,001 - 100,000,000
Chat
Contact Now Start Order
QFN Lead Frame Strips with Mold Cap
- Min. Order:
  Negotiation, Suggest
- Place of origin:
  Korea
- Price Condition:
  FOB
- Supply Ability:
  Buyers request
Standard Systems can also build Small volume to Medium-Large amount order after prototype. We can supply BGA substrates with mold encapsulation for blade sawing test and solder ball attach or solder ball placement test QFN lead frames with mold cap are also available. We provides services with solution that meet our costomer`s budget and size objectives.

[Related Keywords : Package Saw test, BGA substrate with mold, QFN strip with mold]
- Standard Systems
- Business Type
  Manufacturer
- Location
  Seoul, Korea
- Employees Total
  1 - 5
- Annual Revenue
  USD 1,000,001 - 2,000,000
Contact Now Start Order
Epoxy Leader Tape for Chip Packaging
- Place of origin:
  China
- Price Condition:
  FOB
workability with excellent hot hardness. Excellent in adhesion to copper foil or to adhesive agent Excellent in insulation resistance. Excellent in chemical resistance Low temp. Curable (Max. 160C ) Compared with PI film, Excellent in demensional stability with proper stiffness Applications IC substrate for Smart cards IC substrate for BGA, CSP or COB Small size LCD driver substrate.

[Related Keywords : Epoxy Tape]
- Sanwei (Hong Kong) Co., Ltd.
- Business Type
  Manufacturer
- Location
  Guangdong, China
- Employees Total
  101 - 500
- Annual Revenue
  USD 100,000 - 500,000
Contact Now Start Order
2 related Products from this Supplier

DOCBOND|Underfill DB840B
- Min. Order:
  20 Piece
- Price:
  US$ 40
- Place of origin:
  China
DB840B The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by mismatching of overall temperature expansion characteristics between the silicon chip and the substrate or external forces. Fast curing when heated. The lower viscosity characteristics allows for bet

[Related Keywords : waterproof glue, DOCBOND, Underfill]
- Qingdao Docbond New Material Co.,Ltd
- Business Type
  Manufacturer
- Location
  Shandong, China
- Employees Total
  101 - 500
- Annual Revenue
  USD 100,000 - 500,000
Contact Now Start Order

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