Min. Order:
100 Pack
Price:
US$ 4~6
Place of origin:
China
BGA repair and reballing 6. ICT, Constant Temperature Burn-in and Function Test 7. Stencil,Cables and Enclosure building 8. Standard Packing and On time Delivery Main Products The above are the main products we recommend for you. We have many other products that are not shown here. If you have any needs, you can also click the link below to get more information.Aluminum Substrate PCA Ceramic Cir
[Related Keywords : Ceramic Circuit Board, Ceramic pcb, PCB Board, LED PCB]
Business Type
Manufacturer
Location
Jiangsu, China
Employees Total
51 - 100
Annual Revenue
USD 500,001 - 1,000,000
Min. Order:
20 Piece
Price:
US$ 40
Place of origin:
China
DB840B The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by mismatching of overall temperature expansion characteristics between the silicon chip and the substrate or external forces. Fast curing when heated. The lower viscosity characteristics allows for bet
[Related Keywords : waterproof glue, DOCBOND, Underfill]
Business Type
Manufacturer
Location
Shandong, China
Employees Total
101 - 500
Annual Revenue
USD 100,000 - 500,000
Place of origin:
China
workshop 01005 SMD components, 0.2mm BGA placement capacity and quality control capabilities are very mature. With 12 temperature zone nitrogen reflow furnace, the reflow soldering can be compatible with different PCB thickness (0.5mm ~ 3.2mm) and material (paper substrate, glass fiber substrate, synthetic fiber substrate, non-woven substrate, composite substrate, PFC board) .
[Related Keywords : PCBA, PCB design, iMES Cloud System]
Business Type
Manufacturer
Location
Guangdong, China
Employees Total
101 - 500
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
1 Piece
Price:
US$ 2
Place of origin:
China
Supply Ability:
60,000 Piece/ per Month
substrate is separated between the layers. After each layer of the circuit is printed, each layer of the circuit is overlapped by pressing. After drilling, the electrical connection between them is usually achieved through plated through holes on the cross section of the circuit board. Multilayer PCB or multilayer printed circuit boards are circuit boards composed of two or more conductive layers
[Related Keywords : Double-Sided PCB, PCB, New Energy PCB, PCBA]
Business Type
Manufacturer
Location
Guangdong, China
Employees Total
101 - 500
Annual Revenue
USD 50,000,001 - 100,000,000
Min. Order:
Negotiation, Suggest
Place of origin:
Korea
Price Condition:
FOB
Supply Ability:
Buyers request
Standard Systems can also build Small volume to Medium-Large amount order after prototype. We can supply BGA substrates with mold encapsulation for blade sawing test and solder ball attach or solder ball placement test QFN lead frames with mold cap are also available. We provides services with solution that meet our costomer`s budget and size objectives.
[Related Keywords : Package Saw test, BGA substrate with mold, QFN strip with mold]
Business Type
Manufacturer
Location
Seoul, Korea
Employees Total
1 - 5
Annual Revenue
USD 1,000,001 - 2,000,000
Place of origin:
China
Price Condition:
FOB
workability with excellent hot hardness. Excellent in adhesion to copper foil or to adhesive agent Excellent in insulation resistance. Excellent in chemical resistance Low temp. Curable (Max. 160C ) Compared with PI film, Excellent in demensional stability with proper stiffness Applications IC substrate for Smart cards IC substrate for BGA, CSP or COB Small size LCD driver substrate.
[Related Keywords : Epoxy Tape]
Business Type
Manufacturer
Location
Guangdong, China
Employees Total
101 - 500
Annual Revenue
USD 100,000 - 500,000
Competitive bga substrate products from various bga substrate manufacturers and bga substrate suppliers are listed above, please select quality and cheap items for you.
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