Min. Order:
5 Piece
Price:
US$ 80
Place of origin:
China
Price Condition:
FOB shanghai
Supply Ability:
1000 pieces/month
Rigidity And Cut Quality
Application: Electronic Parts, Optical Devices, Semiconductor Packages, BGA, CSP
Electroformed Dicing Blade
Features: Wide Selection Of Blade Options; Proprietary Thin-Blade Technology ;Blade Thickness - 0.015 Mm To 0.3 Mm; Available For Both Dicing Saws And Slicers
Application: Various Types Of Semiconductor Packages, Ceramics, Magnetic Materials, PCB, Silicon
[Related Keywords : diamond dicing blade]