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Products > forming process > Fujian Acetron New Materials CO. , Ltd | Similar Products

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forming process

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Planar Alloy Sputtering Target: Formula Purity Forms Specification Si+Al 99.9% / 99.99% Planar / Rotary Customized Ni+Cr 99.8% / 99.99% Planar Customized Ti+Al 99.6% / ...

Rotary Ceramic Sputtering Target: formity: powder metallurgy process to ensure the overall uniformity of the target. Excellent electrical properties: Reliable atmosphere sintering enables stable electrical conductivity of oxides with ...

Planar Metal Sputtering Targets: process for thin film deposition across various industries, including semiconductor, electronics, optics, and surface coating. It is a method of transforming a solid material into a liquid or gaseous ...

Planar Ceramic Sputtering Target: formity: powder metallurgy process to ensure the overall uniformity of the target. Excellent electrical properties: Reliable atmosphere sintering enables stable electrical conductivity of oxides with ...

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Planar Alloy Sputtering Target