Rotary Ceramic Sputtering Target
Excellent properties such as high purity, high density,Good microstructure uniformity, excellent electrical properties.
High purity: The metal target requires very high purity, to ensure the stability and reliability of the material.We have various purity levels to suit your specific requirements, with the minimum purity of 99.5% up to 99.9999% for some metals. Also have controlled specific impurities within the target.
High density: Metal targets have high density characteristics, usually up to 95-99.5%,（ITO,NbOx can reach 99.5%) to ensure the stability and quality of materials.
High thermal conductivity: the thermal conductivity of the metal target is particularly high, which can be cooled quickly and improve the coating speed.
Microstructure uniformity: powder metallurgy process to ensure the overall uniformity of the target.
Excellent electrical properties: Reliable atmosphere sintering enables stable electrical conductivity of oxides with semiconductor characteristics.
* Maximum sizes of planar target
Thickness: 30mm (can be 60mm for round target)
Width: max 2000mm
Length: max 4000mm
* Maximum sizes of rotary target
Vacuum/Air Spraying
Backing tubes: ID56 x OD64 x Length300~3000mm, Thickness: 3~5mm
Backing tubes: ID78~83 x OD89~92 x Length300~3000mm, Thickness: 3~7mm
Backing tubes: ID100 x OD108 x Length300~3000mm, Thickness: 3~8mm
Backing tubes: ID125 x OD133 x Length300~4000mm, Thickness: 3~13mm
Bonding
Backing tubes: ID125 x OD133 x Length500~4000mm, Thickness: 8~13mm
* Planar/Rotary target can be customised as per your request.
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Chemical Formula
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Purity
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Forms
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Specification
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SiO₂
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99.995%
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Planar
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Customized
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Nb₂Ox
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99.99%
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Planar / Rotary
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Customized
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TiOx
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99.99%
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Planar / Rotary
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Customized
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ITO Target (In₂O₃+SnO₂ )
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99.99%
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Planar / Rotary
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Customized
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AZO Target (ZnO+Al₂O₃ )
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99.99%
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Planar / Rotary
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Customized
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IGZO Target(In₂O₃+Ga₂O₃+ZnO)
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99.99%
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Planar / Rotary
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Customized
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Sputtering coating refers to the technology that the ions produced by the ion source are accelerated to gather in the vacuum to form a high speed ion beam, which bombards the solid surface, and the kinetic energy exchange between the ions and the solid surface atoms makes the atoms on the solid surface leave the solid and deposit on the surface of the substrate material. The bombarded solid is the raw material for deposition of thin film materials by sputtering method, which is called the sputtering target
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