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Products > forms processing > Fujian Acetron New Materials CO. , Ltd | Similar Products

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Planar Alloy Sputtering Target: Formula Purity Forms Specification Si+Al 99.9% / 99.99% Planar / Rotary Customized Ni+Cr 99.8% / 99.99% Planar Customized Ti+Al 99.6% / ...

Rotary Ceramic Sputtering Target: formity: powder metallurgy process to ensure the overall uniformity of the target. Excellent electrical properties: Reliable atmosphere sintering enables stable electrical conductivity of oxides with ...

Planar Metal Sputtering Targets: form grain: Controlled grain size and direction Good composition uniformity: the component distribution is uniform, ensure the film formation rate is uniform, film quality. Manufacturing processes ...

Planar Ceramic Sputtering Target: formity: powder metallurgy process to ensure the overall uniformity of the target. Excellent electrical properties: Reliable atmosphere sintering enables stable electrical conductivity of oxides with ...

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Planar Alloy Sputtering Target