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Products > Components > Qingdao Docbond New Material Co.,Ltd | Similar Products
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DOCBOND|Two-component Structural Adhesive

DOCBOND|Two-<strong>compon</strong>ent Structural Adhesive
This series of products have high structural bonding strength. In the shear strength test in the laboratory, the bonding property of this product is stronger than that of steel strip. The product is ...

DOCBOND|High Thermal Conductivity Epoxy Adhesive

DOCBOND|High Thermal Conductivity Epoxy Adhesive
This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, ...

DOCBOND|UV Cure Adhesive

DOCBOND|UV Cure Adhesive
This product is a one component UV curing adhesive with excellent adhesion to PC, PMMA, glass and other substrates. It has the characteristics of high bonding strength, low volatility, low shrinkage, ...

DOCBOND|Conductive Adhesive

DOCBOND|Conductive Adhesive
This product is a single component epoxy conductive adhesive with Conductive material as the medium. It is characterized by high purity, high conductivity, low modulus and long service life. The ...

DOCBOND|Acrylic Thermally Conductive Adhesive

DOCBOND|Acrylic Thermally Conductive Adhesive
Thermal Conductive Bonding of Electronic Components The product is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. It has the ...

DOCBOND|Underfill DB840B

DOCBOND|Underfill DB840B
DB840B The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by ...

DOCBOND|Low Temperature Curing Adhesive

DOCBOND|Low Temperature Curing Adhesive
DB291 This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a ...

DOCBOND|Water Adhesive for Fuel Cell Bipolar Plate

DOCBOND|Water Adhesive for Fuel Cell Bipolar Plate
The application of this series of product in hydrogen fuel electric reactor is：double plate water bonding The product is a single component，high temperature resistance，activated epoxy resin，on a ...

DOCBOND|sealant for Gas Path of Fuel Cell Bipolar Plate

DOCBOND|sealant for Gas Path of Fuel Cell Bipolar Plate
The application of this series of products in hydrogen fuel electric reactor is：double plate gas-path adhesive seal，instead of the traditional seal ring This product is a single component，thermally ...

DOCBOND|microporous Plugging Agent for Graphite Bipolar Plate

DOCBOND|microporous Plugging Agent for Graphite Bipolar Plate
Microporous plugging agent for graphite bipolar plate of fuel cell This series of product are used for impregnation and filling of bipolar plate in hydrogen fuel electric reactor. tightness，chemical ...
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