There are 15 DOCBOND from 1 suppliers on EC21.com
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DB291
This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a very short time. The product has excellent working performance and high storage stability. This product is suitable for low-temperature curing process, mainly used for bonding heat-sensitive components,suitable for memory cards, CCD/CMOS, LED backlights etc.

| Registration Date | 2023/02/02(Year/Month/Date) |
|---|---|
| Buyer / Seller in EC21 | Seller |
| Business Type | Manufacturer |
| Year established | 2020 |
| Employees total | 101 - 500 |
| Annual revenue | USD 100,000 - 500,000 |
| Company | Qingdao Docbond New Material Co.,Ltd |
|---|---|
| Address | No. 628, Jiushui East Road, Laoshan DistrictQingdaoShandong266100China |
| Phone | 86 - 0532 - 81700039 |
| Homepage | www.Qingdaodocbondchina.com |
| Contact | CHONGLE LIANG |