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DOCBOND|Acrylic Thermally Conductive Adhesive: Thermal Conductive Bonding of Electronic Components The product is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. It has the ...

DOCBOND|Underfill DB840B: DB840B The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by ...

DOCBOND|Low Temperature Curing Adhesive: DB291 This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a ...

DOCBOND|Water Adhesive for Fuel Cell Bipolar Plate: The application of this series of product in hydrogen fuel electric reactor is：double plate water bonding The product is a single component，high temperature resistance，activated epoxy resin，on a ...

DOCBOND|microporous Plugging Agent for Graphite Bipolar Plate: Microporous plugging agent for graphite bipolar plate of fuel cell This series of product are used for impregnation and filling of bipolar plate in hydrogen fuel electric reactor. tightness，chemical ...

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DOCBOND|Acrylic Thermally Conductive Adhesive