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Products > High performance > Qingdao Docbond New Material Co.,Ltd | Similar Products

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DOCBOND|High Thermal Conductivity Epoxy Adhesive: This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, ...

DOCBOND|Low Temperature Curing Adhesive: DB291 This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a ...

DOCBOND|Water Adhesive for Fuel Cell Bipolar Plate: The application of this series of product in hydrogen fuel electric reactor is：double plate water bonding The product is a single component，high temperature resistance，activated epoxy resin，on a ...

DOCBOND|sealant for Gas Path of Fuel Cell Bipolar Plate: The application of this series of products in hydrogen fuel electric reactor is：double plate gas-path adhesive seal，instead of the traditional seal ring This product is a single component，thermally ...

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DOCBOND|High Thermal Conductivity Epoxy Adhesive