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Products > cure > Qingdao Docbond New Material Co.,Ltd | Similar Products
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" found 10 Products from Qingdao Docbond New Material Co.,Ltd, China
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DOCBOND|UV Cure Adhesive

DOCBOND|UV Cure Adhesive
This product is a one component UV curing adhesive with excellent adhesion to PC, PMMA, glass and other substrates. It has the characteristics of high bonding strength, low volatility, low shrinkage, ...

DOCBOND|UV Cure Liquid Sealant

DOCBOND|UV Cure Liquid Sealant
DB724 This product provides a strong adhesion seal for shaft seals, metals, glass, plastics, etc., and can replace traditional seal ring. Mainly used in sealing of oil cooling system, engine cover, ...

DOCBOND|Low Temperature Curing Adhesive

DOCBOND|Low Temperature Curing Adhesive
DB291 This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a ...

DOCBOND|High Thermal Conductivity Epoxy Adhesive

DOCBOND|High Thermal Conductivity Epoxy Adhesive
This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, ...

DOCBOND|Conductive Adhesive

DOCBOND|Conductive Adhesive
This product is a single component epoxy conductive adhesive with Conductive material as the medium. It is characterized by high purity, high conductivity, low modulus and long service life. The ...

DOCBOND|Acrylic Thermally Conductive Adhesive

DOCBOND|Acrylic Thermally Conductive Adhesive
Thermal Conductive Bonding of Electronic Components The product is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. It has the ...

DOCBOND|In-Mold Injection Adhesive

DOCBOND|In-Mold Injection Adhesive
DB1109 This product is a single coating adhesive. It can be dried at a low temperature and then cured at a high temperature to adapt to the bonding of various substrates. Such as: PVC, ABS, PMMA, PC, ...

DOCBOND|Underfill DB840B

DOCBOND|Underfill DB840B
DB840B The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by ...

DOCBOND|Water Adhesive for Fuel Cell Bipolar Plate

DOCBOND|Water Adhesive for Fuel Cell Bipolar Plate
The application of this series of product in hydrogen fuel electric reactor is：double plate water bonding The product is a single component，high temperature resistance，activated epoxy resin，on a ...

DOCBOND|sealant for Gas Path of Fuel Cell Bipolar Plate

DOCBOND|sealant for Gas Path of Fuel Cell Bipolar Plate
The application of this series of products in hydrogen fuel electric reactor is：double plate gas-path adhesive seal，instead of the traditional seal ring This product is a single component，thermally ...
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