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DOCBOND|High Thermal Conductivity Epoxy Adhesive: This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, ...

DOCBOND|Conductive Adhesive: This product is a single component epoxy conductive adhesive with Conductive material as the medium. It is characterized by high purity, high conductivity, low modulus and long service life. The ...

DOCBOND|UV Cure Liquid Sealant: DB724 This product provides a strong adhesion seal for shaft seals, metals, glass, plastics, etc., and can replace traditional seal ring. Mainly used in sealing of oil cooling system, engine cover, ...

DOCBOND|In-Mold Injection Adhesive: DB1109 This product is a single coating adhesive. It can be dried at a low temperature and then cured at a high temperature to adapt to the bonding of various substrates. Such as: PVC, ABS, PMMA, PC, ...

DOCBOND|Low Temperature Curing Adhesive: DB291 This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a ...

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