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Products > work > Qingdao Docbond New Material Co.,Ltd | Similar Products
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DOCBOND|High Thermal Conductivity Epoxy Adhesive

DOCBOND|High Thermal Conductivity Epoxy Adhesive
This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, ...

DOCBOND|Low Temperature Curing Adhesive

DOCBOND|Low Temperature Curing Adhesive
DB291 This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a ...
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