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Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0

Bergquist Gap Pad HC5.0  GAP PADTGP HC5000 BERGQUIST GPHC5.0
BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal ...

Laird Tflex 600 Thermal Gap Filler

Laird Tflex 600 Thermal Gap Filler
FEATURES AND BENEFITS • Very high compliancy for low stress applications • 3 W/mK thermal conductivity • Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm) • Naturally tacky, needs no ...
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