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AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,: Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan. -The low-density characteristic gives it an irreplaceable ...

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment: make it less prone to warping and deformation due to external stress or internal thermal stress. Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat ...

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC: Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan. -The low-density characteristic gives it an irreplaceable ...

High Strength MaterialsLightweight Materials High Thermal Conductivity MaterialAl-SiC,Al/SiC: make it less prone to warping and deformation due to external stress or internal thermal stress. Specification Silicon Carbide volume fraction Customized Density（g/cm³） 2.82-3.02 Elastic ...

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AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,