AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,

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Price

US$ 98

Min Order Quantity10 Piece
Supply Ability20000pieces per Month
Delivery Lead Time18days
Payment Terms 7
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* Date last updated : 2025.10.31

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Supplier Info.

Company Name Henan Hanyin Optoelectronics Technology Co., Ltd
Membership TradeVerify
Registration Date2025.06.30
Country/RegionChina
CityLuoyang
Contact Simon Hu(Mr.)

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Henan Hanyin Optoelectronics Technology Co., Ltd

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Product Attributes

- Place of Origin China
- Supply Type OEM Service
- Condition New
- Related Keywords Aluminum based materials, Aluminum Composite Materi, Thermal conductive

Description by Manufacturer

Advantages

-Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan.

-The low-density characteristic gives it an irreplaceable advantage in weight sensitive applications.

-The high specific rigidity is several times that of steel, and its excellent structural support and vibration resistance ensure the stability of components in harsh environments.

-High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal stress.

Specification

Silicon Carbide	volume fraction Customized
Density（g/cm³）	2.82-3.02
Elastic Modulus（GPa）	95-220
Bending Strength（MPa）	Customized
Tensile Strength （MPa）	Customized
Coefficient of Thermal Expansion（10-6/K）	7-17
Thermal Conductivity（W/m·K）	Customized

Product Features

-Adjustable coefficient of thermal expansion (CTE)

-Excellent thermal conductivity and heat dissipation performance

-Low density and high specific rigidity

-High rigidity and high strength Excellent thermal shock resistance

-Excellent wear resistance -Surface Machinability and Metalization

Application Fields

-Semiconductor packaging

-Automotive industry

-EADS

-Optical system Precision Instrument

-Racing engine pushrods

-AlSiC box structure parts

-Robot engine putters

-Helicopter accessories

Price

Price US$ 98 / Piece

Packaging & Shipping

- PackingCustomized
- Delivery Lead Time18days
- Minimum Order 10 Piece
- Supply Ability20000pieces per Month
- Total quantity in StockOver 5000
- Shipping Career

Product Image

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment, 2

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment, 3

Aluminum Based Materials Related Products

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- Henan Hanyin Optoelectronics Technology Co., Ltd is mainly exporting to Asia, Europe, North America, South America, Australia, Africa

Company Profile

About Henan Hanyin Optoelectronics Technology Co., Ltd

Membership
Registration Date2025.06.30
Country/RegionChina
CityLuoyang
Contact Simon Hu(Mr.)

Henan Hanyin Optoelectronics Technology Co., Ltd. was registered on July 1, 2020, with a registered capital of 60 million yuan, and its address is located in the Optoelectronic Industry Park, Yichuan County, Luoyang City. The company mainly produces Aluminum Silicon Carbide (AlSiC) metal matrix composites, with large specifications, high performance, high thermal conductivity, lightweight properties, low expansion and other characteristics,is for aviation, aerospace, energy, electronics, transportation, medical and other fields, research and development, production and sales of new materials integration of science and technology enterprises.
Our experts and engineers are committed to delivering the solutions with the high performance, high CTE (coefficient of thermal expansion), high thermal conductivity and sustainable competitive advantages toÂ replace aluminum, copper, steel, titanium and cast iron components across a broad range of industries.
Our team is dedicated to providing unwavering service to our customers while staying at the forefront of technologies essential to their success.. Our goal is to build a reputation of resolving intricate challenges through innovative material solutions, thus empowering our clients with enhanced performance and technological advancement.

Selling Categories

- Electronic Components & Supplies >> Electronic Products & Components Processing
- Hardware >> Abrasives
- Manufacturing & Processing Machinery >> Metal Processing Machinery
- Minerals & Metallurgy >> Alloy
- Minerals & Metallurgy >> Refractory

Keywords

Aluminum Silicon Carbide , Metal Matrix Composite , Ceramic Material , Ceramic Substrate

Registration Date	2025/06/30(Year/Month/Date)
Buyer / Seller in EC21	Seller
Business Type	Manufacturer
Year established	2020
Employees total	11 - 50
Annual revenue	USD 2,000,001 - 5,000,000

Contact Information Order Credit Report

Company	Henan Hanyin Optoelectronics Technology Co., Ltd
Address	Baisha Town Optoelectronic New Materials Industrial ParkLuoyangHenan471300China
Phone	86 - 0379 - 62221168
Homepage	www.hnhanyin.com
Contact	Simon Hu

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AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,

Product Attributes

Description by Manufacturer

Price

Packaging & Shipping

Product Image

Aluminum Based Materials Related Products

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Main Export Markets

Company Profile

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