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AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,: Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan. -The low-density characteristic gives it an irreplaceable ...

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment: external stress or internal thermal stress. Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation performance -Low density and high specific ...

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC: Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan. -The low-density characteristic gives it an irreplaceable ...

High Power Packaging Materials,Mobile Phone, Tablet, Laptop Heat Dissipation Patch,Al-SiC,AlSiC: due to external stress or internal thermal stress. Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation performance -Low density ...

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials: the stability of components in harsh environments. -High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal stress. Product ...

Aluminum Silicon Carbide,AlSiC Is A High-strength and High Thermal Conductivity Ceramic Material: ensure the stability of components in harsh environments. -High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal stress. Product ...

High Strength MaterialsLightweight Materials High Thermal Conductivity MaterialAl-SiC,Al/SiC: external stress or internal thermal stress. Specification Silicon Carbide volume fraction Customized Density（g/cm³） 2.82-3.02 Elastic Modulus（GPa） 95-220 Bending Strength（MPa） Customized Tensile ...

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AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,