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Products > machine and machinery > Henan Hanyin Optoelectronics Technology Co., Ltd | Similar Products
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machine and machinery

" found 11 Products from Henan Hanyin Optoelectronics Technology Co., Ltd, China
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(1-11 out of 11)

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC
and heat-resistant parts. Automotive: Brake rotors, pistons, and engine blocks. Electronics: Heat sinks, housings, and thermal management systems. Industrial Equipment: High-strength and ...

Silicon Carbide Reinforced Aluminum,Aluminum Metal Matrix Composites,Lightweight Materials,AlSiC

Silicon Carbide Reinforced Aluminum,Aluminum Metal Matrix Composites,Lightweight Materials,AlSiC
and heat dissipation performance -Low density and high specific rigidity -High rigidity and high strength -Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and ...

Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material,Al/SIC,Aluminum Ceramic Al-SiC

Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material,Al/SIC,Aluminum Ceramic Al-SiC
and heat dissipation performance -Low density and high specific rigidity -High rigidity and high strength -Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and ...

Al-SiC Structural Parts,Components and Parts,Communication Cavity Material,Aluminum Ceramic Material

Al-SiC Structural Parts,Components and Parts,Communication Cavity Material,Aluminum Ceramic Material
and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine ...

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate
of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock ...

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC
and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine ...

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material
and heat dissipation performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and ...

Ceramic Substrate,Ceramic Materia,Thermal Pad,Electronic Substrat,Aluminum Silicon Carbide

Ceramic Substrate,Ceramic Materia,Thermal Pad,Electronic Substrat,Aluminum Silicon Carbide
Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

AlSIC,Aluminum Ceramic Al-SiC,Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material

AlSIC,Aluminum Ceramic Al-SiC,Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material
and heat dissipation performance -Low density and high specific rigidity -High rigidity and high strength -Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and ...

Aluminum Silicon Carbide Pipe,Thermal Conductive Material,Lightweight Materials,AlSiC,Al/SiC,Al-SiC

Aluminum Silicon Carbide Pipe,Thermal Conductive Material,Lightweight Materials,AlSiC,Al/SiC,Al-SiC
and heat dissipation performance -Low density and high specific rigidity -High rigidity and high strength -Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and ...

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC
and heat dissipation performance -Low density and high specific rigidity -High rigidity and high strength -Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and ...
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