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Products > machine application > Henan Hanyin Optoelectronics Technology Co., Ltd | Similar Products
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" found 31 Products from Henan Hanyin Optoelectronics Technology Co., Ltd, China
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(1-20 out of 31)

Precision Instrument Materials ,Aerospace Materials ,Optoelectronic Materials,Al/SiC,Al-SIC

Precision Instrument Materials ,Aerospace Materials ,Optoelectronic Materials,Al/SiC,Al-SIC
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Metal Matrix Composite Ceramic Materials ,Semiconductor Material,Alumina Ceramic,AlSiC,Al-SiC,Al/SiC

Metal Matrix Composite Ceramic Materials ,Semiconductor Material,Alumina Ceramic,AlSiC,Al-SiC,Al/SiC
Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation performance -Low density and high specific rigidity -High rigidity and high ...

Electronic Packaging Materials,Heat Sinks,Semiconductor Packaging & Assembly Materials,Al-SiC,AlSiC

Electronic Packaging Materials,Heat Sinks,Semiconductor Packaging & Assembly Materials,Al-SiC,AlSiC
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

AlSIC,Aluminum Ceramic Al-SiC,Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material

AlSIC,Aluminum Ceramic Al-SiC,Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material
Machinability and Metalization Applications -Electronic component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power engineering -Renewable ...

AlSiC,Al/SiC,Al-SiC,Metal Matrix Composite,Aluminum Ceramic Material,Aluminum Alloy

AlSiC,Al/SiC,Al-SiC,Metal Matrix Composite,Aluminum Ceramic Material,Aluminum Alloy
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Aluminum Matrix Composite,Thermal Conductive Material,Aluminum Alloy,Aluminum Ceramic,Al-SiC,AlSiC

Aluminum Matrix Composite,Thermal Conductive Material,Aluminum Alloy,Aluminum Ceramic,Al-SiC,AlSiC
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Aluminum Silicon Carbide Pipe,Thermal Conductive Material,Lightweight Materials,AlSiC,Al/SiC,Al-SiC

Aluminum Silicon Carbide Pipe,Thermal Conductive Material,Lightweight Materials,AlSiC,Al/SiC,Al-SiC
Machinability and Metalization Applications -Electronic component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power engineering -Smart ...

High Strength MaterialsLightweight Materials High Thermal Conductivity MaterialAl-SiC,Al/SiC

High Strength MaterialsLightweight Materials High Thermal Conductivity MaterialAl-SiC,Al/SiC
Machinability and MetalizationApplications -High-Power Electronic Devices -Thermal Management Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Aluminum Heatsink,Aluminum Base,Thermal Substrate,Semiconductor Packaging Materials,Al-SiC,AlSiC

Aluminum Heatsink,Aluminum Base,Thermal Substrate,Semiconductor Packaging Materials,Al-SiC,AlSiC
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Heat Sinks,Electronic Packaging Materials,Semiconductor Packaging & Assembly Materials,Al-SiC,Al/SiC

Heat Sinks,Electronic Packaging Materials,Semiconductor Packaging & Assembly Materials,Al-SiC,Al/SiC
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Aluminum Metal Matrix Composites ,Precision Component Materials,Semiconductor Materials,Al/SiC

Aluminum Metal Matrix Composites ,Precision Component Materials,Semiconductor Materials,Al/SiC
Machinability and MetalizationApplications -High-Power Electronic Devices -Thermal Management Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC
density and high specific rigidity -High rigidity and high strength -Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Aluminum Silicon Carbide ...

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC
Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter ...

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,
of Thermal Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment
applications. -The high specific rigidity is several times that of steel, and its excellent structural support and vibration resistance ensure the stability of components in harsh environments. -High ...

Silicon Carbide Reinforced Aluminum,Aluminum Metal Matrix Composites,Lightweight Materials,AlSiC

Silicon Carbide Reinforced Aluminum,Aluminum Metal Matrix Composites,Lightweight Materials,AlSiC
Machinability and MetalizationApplications -High-Power Electronic Devices -Thermal Management Applications -Electronic component thermal management -High-precision machinery -Aerospace ...

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material,Al/SIC,Aluminum Ceramic Al-SiC

Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material,Al/SIC,Aluminum Ceramic Al-SiC
Machinability and MetalizationApplications -High-Power Electronic Devices -Thermal Management Aluminum Silicon Carbide Applications -Electronic component thermal management -High-precision ...
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