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Products > sensitive components > Henan Hanyin Optoelectronics Technology Co., Ltd | Similar Products

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AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,: Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan. -The low-density characteristic gives it an irreplaceable ...

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment: component reliability and lifespan. -The low-density characteristic gives it an irreplaceable advantage in weight sensitive applications. -The high specific rigidity is several times that of steel, ...

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC: Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan. -The low-density characteristic gives it an irreplaceable ...

High Power Packaging Materials,Mobile Phone, Tablet, Laptop Heat Dissipation Patch,Al-SiC,AlSiC: sensitive applications. -The high specific rigidity is several times that of steel, and its excellent structural support and vibration resistance ensure the stability of components in harsh ...

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials: component reliability and lifespan. -The low-density characteristic gives it an irreplaceable advantage in weight sensitive applications. -The high specific rigidity is several times that of steel, ...

Aluminum Silicon Carbide,AlSiC Is A High-strength and High Thermal Conductivity Ceramic Material: component reliability and lifespan. -The low-density characteristic gives it an irreplaceable advantage in weight sensitive applications. -The high specific rigidity is several times that of steel, ...

High Strength MaterialsLightweight Materials High Thermal Conductivity MaterialAl-SiC,Al/SiC: sensitive applications. -The high specific rigidity is several times that of steel, and its excellent structural support and vibration resistance ensure the stability of components in harsh ...

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AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,