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Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate
of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock ...

Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate

Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC  IGBT Base Plate
Carbide volume fraction 65 % Density (g/cm³) 3.01 Elastic Modulus (GPa) 215±5 Bending Strength (MPa) 380 Tensile Strength (MPa 270 Coefficient of Thermal Expansion (10-6/K) 7.5±1 Thermal ...

Aluminum Silicon Carbide IGBT Base Plate

Aluminum Silicon Carbide IGBT Base Plate
Modulus (GPa) 215±5 Bending Strength (MPa) 380 Tensile Strength (MPa 270 Coefficient of Thermal Expansion (10-6/K) 7.5±1 Thermal Conductivity (W/m·K) 210±10 Aluminum Silicon Carbide IGBT Base Plate ...

Aluminum Based Silicon Carbide Electronic Substrate

Aluminum Based Silicon Carbide Electronic Substrate
electronic packaging, Aluminum Silicon Carbide IGBT Base Plates are irreplaceable materials due to their unique combination of high thermal conductivity, low thermal expansion coefficient, and ...
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