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Soldering Process: Hot blast circulation type This pin carrier type reflow furnace uses downflow hot blast circulation as the heating method. This method provides uniform heating across printed circuit boards, ...

Water Process: Vertical Furnace for 300 -mm Wafers The VF-5900 furnace is a continuation of the VF-5300 model and has been developed to welcome the new age of 300-mm silicon wafers. The VF-5900 has a ...

INH/Inert: INH/Inert Convection type oven with air tight chamber. Summary Non air process, such as the temperature testing, ceramic de-binding and so forth, can be performed with various gas injections, ...

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Soldering Process