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Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System: machine, and independent research and development: automatic transfer machine, modified automatic capping machine, manual gold wire ball welding machine, aluminum wire welding machine, tooling ...

Semiconductor Plastic Packaging Equipment / Photoelectric Semiconductor Packaging System: machine, and independent research and development: automatic transfer machine, modified automatic capping machine, manual gold wire ball welding machine, aluminum wire welding machine, tooling ...

LED Molding Equipment / TM10X-Molding Machine: machine, and independent research and development: automatic transfer machine, modified automatic capping machine, manual gold wire ball welding machine, aluminum wire welding machine, tooling ...

Semiconductor Molding Equipment Fou Display LED Plastic Package: machine, and independent research and development: automatic transfer machine, modified automatic capping machine, manual gold wire ball welding machine, aluminum wire welding machine, tooling ...

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Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System