The company's main business scope:
1. Technology development, assembly and sales of semiconductor automation equipment; existing new development equipment: MINILED glue injection film press integrated machine, photoelectric automatic eutectic machine eutectic furnace, etc.
2. Provide new/second-hand KS series, KAIJO series, ASM series and other automatic wire welding machines, ASM860, 862 automatic crystal bonder, DAGE tensile testing machine, and independent research and development: automatic transfer machine, modified automatic capping machine, manual gold wire ball welding machine, aluminum wire welding machine, tooling fixture, etc.;
3. The models produced by the company are mainly suitable for automatic packaging of optical communication devices. Such as TO38, TO39, TO46, TO56, and COB and other related devices.
4. Technical service Provide repair, maintenance, modification and other services, and provide customers with professional supporting process improvement and solutions. At the same time, it provides professional technical support for ASM, KNS, Kaijo and other mainstream packaging equipment.Molding technologies are used to seal semiconductors by electrically insulating them from the outside using resin. These technologies are essential to ensure the reliability of semiconductors !
Using servo press, clamping force can reach 120 tons
Compatible with large lead frames of 90mmx300mm
Standardized mold structure, easy to replace
High-efficiency cake feeding components
Support flexible expansion of up to 4 sets of presses to achieve high UPH
Equipped with a vision system to identify the feeding direction
Optional vacuum function
■ Vacuum thermoforming technology
■ Full servo motor drive
■ Three-channel vacuum system
■ Use the most advanced separation membrane technology to reduce the waste of molding materials
■ Easy to release the mold. The machine is clean. The mold is not corroded. The service life is increased
■ Universal dispensing system
■ Static elimination equipment, improve yield rate. The machine can be spliced to improve capital efficiency. It is suitable for small batch and large batch production. It can splice 1 host + 5 modules (MAX). Automatic loading and unloading module (option)
Features
1. Optimal for various kinds of LED packages with variable quantity production
2. Tuoxin proprietary compression molding method
3. Optimal for high-volume production of LED packages
4. Modular concept to adapt to different production quantities (up to 4 presses)
5. Ensures even, stable lens shape and high-precision molded products
6. Mmanually loaded substrae and automatically applied silicone resin on the chase
7. Environmentally friendly equipment that generates no waste
The company's main business scope:
1. Technology development, assembly and sales of semiconductor automation equipment; existing new development equipment: MINILED glue injection film press integrated machine, photoelectric automatic eutectic machine eutectic furnace, etc.
2. Provide new/second-hand KS series, KAIJO series, ASM series and other automatic wire welding machines, ASM860, 862 automatic crystal bonder, DAGE tensile testing machine, and independent research and development: automatic transfer machine, modified automatic capping machine, manual gold wire ball welding machine, aluminum wire welding machine, tooling fixture, etc.;
3. The models produced by the company are mainly suitable for automatic packaging of optical communication devices. Such as TO38, TO39, TO46, TO56, and COB and other related devices.
4. Technical service Provide repair, maintenance, modification and other services, and provide customers with professional supporting process improvement and solutions. At the same time, it provides professional technical support for ASM, KNS, Kaijo and other mainstream packaging equipment.
LED semiconductor plastic packaging equipment is used to package LED chips into LED lamp beads. LED chips are usually made of semiconductor materials, while LED lamp beads need to package the chips in plastic or other materials to protect them from the external environment.
LED semiconductor plastic packaging equipment usually includes the following parts:
Chip bonding: Paste the LED chip on the conductive support. The process requires high-precision equipment and techniques to ensure the exact position and orientation of the chip.
Packaging: The chip is placed in a plastic mold, and then injected with molten plastic, allowing it to solidify into a complete plastic package. This process needs to control parameters such as temperature and injection pressure to ensure the quality and stability of the plastic package.
Cutting: Cut the plastic package into individual LED lamp beads. This process requires high-precision equipment and technology to ensure the consistent size and shape of each LED bead.
We specialize in R&D and production of semiconductor packaging equipment and chip packaging equipment: including automatic plastic sealing system, intelligent automatic cutting and forming separation system, cutting and forming equipment, automatic plastic sealing press, automatic chip arrangement machine, flushing channel residual glue machine, etc. Etc., not only customizing a single device, but also committed to solving the complete system solution of semiconductor packaging, customized on demand, high precision, stable performance, guaranteed quality, and permanent provision of high-quality services.
