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Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System

Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System
process needs to control parameters such as temperature and injection pressure to ensure the quality and stability of the plastic package. Cutting: Cut the plastic package into individual LED lamp ...

LED Molding Equipment / TM10X-Molding Machine

LED Molding Equipment / TM10X-Molding Machine
The process requires high-precision equipment and techniques to ensure the exact position and orientation of the chip. Packaging: The chip is placed in a plastic mold, and then injected with molten ...

Semiconductor Molding Equipment Fou Display LED Plastic Package

Semiconductor Molding Equipment Fou Display LED Plastic Package
The process requires high-precision equipment and techniques to ensure the exact position and orientation of the chip. Packaging: The chip is placed in a plastic mold, and then injected with molten ...
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