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Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System

Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System
control parameters such as temperature and injection pressure to ensure the quality and stability of the plastic package. Cutting: Cut the plastic package into individual LED lamp beads. This process ...

LED Molding Equipment / TM10X-Molding Machine

LED Molding Equipment / TM10X-Molding Machine
modules (MAX). Automatic loading and unloading module (option) Features of semiconductor plastic packaging equipment ●Semiconductor plastic sealing equipment is also called automatic plastic sealing ...

Semiconductor Molding Equipment Fou Display LED Plastic Package

Semiconductor Molding Equipment Fou Display LED Plastic Package
The process requires high-precision equipment and techniques to ensure the exact position and orientation of the chip. Packaging: The chip is placed in a plastic mold, and then injected with molten ...
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