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Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System: variable quantity production 2. Tuoxin proprietary compression molding method 3. Optimal for high-volume production of LED packages 4. Modular concept to adapt to different production quantities (up ...

Semiconductor Plastic Packaging Equipment / Photoelectric Semiconductor Packaging System: variable quantity production 2. Tuoxin proprietary compression molding method 3. Optimal for high-volume production of LED packages 4. Modular concept to adapt to different production quantities (up ...

Semiconductor Molding Equipment Fou Display LED Plastic Package: variable quantity production 2. Tuoxin proprietary compression molding method 3. Optimal for high-volume production of LED packages 4. Modular concept to adapt to different production quantities (up ...

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Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System