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Place of origin:
Japan
Thermoplastic Multilayer Film Dicing film for semiconductor production. Back Grinding Film. Die Attach Film. Features Contributes to improving semiconductor quality and yield by minimizing fish eyes. Applications/Examples of Use Polyolefin film for semiconductor processes We carry wide variety of thicknesses, widths, and hardness. We have a network of engineers in Japan.Please feel free to contac
[Related Keywords : Thermoplastic Elastomer, Thermoplastic Multilayer, dicing film, semiconductor production]
Business Type
Supplier
Location
Tokyo, Japan
Employees Total
6 - 10
Annual Revenue
USD 1,000,001 - 2,000,000
Place of origin:
Korea
Semiconductor field : Wafer back-grinding and dicing of semiconductor processes - Specialty field : High humidity activated film / Thermal Transfer Tape / Thermal Release Tape - Battery field : Insulation Tape - (F)PCB field : High Heat-Resistant Tape / Carrier Tape / Masking Tape - Home appliances field : Protection of products/parts such as refrigerators, air conditioners, washing machines, et
[Related Keywords : Protection Tape, PI Tape, PET Tape, Protective Tape]
Business Type
Supplier
Location
SINGAPORE, Singapore
Employees Total
1 - 5
Annual Revenue
USD 500,001 - 1,000,000
Min. Order:
1 Bushel
Price:
US$ 1
Place of origin:
China
back grinding wheel features free cutting, excellent wear resistance, and good shape maintainability for long durability. Performance of Wafer Back Grinding Wheel Leading technology Good self-sharpening No dressing required High yeild rate of work-piece Applications of Wafer Back Grinding Wheel Used for wafer's back thinning in LED and Semiconductor industries. Specifications of Wafer Grinding Wh
[Related Keywords : metal bond diamond wheel]
Business Type
Manufacturer
Location
Henan, China
Employees Total
101 - 500
Annual Revenue
USD 1,000,001 - 2,000,000
Min. Order:
3000 Square Meter
Price:
US$ 1 ~ 3
Place of origin:
Korea
Supply Ability:
500,000 squre meters per day
t is excellent for surface protection of substrates such as wafers in semiconductor, backgrinding and dicing processes. Daehyunst is providing special, high-performance tapes according to the diversification and high quality of chips. We develop and supply products to meet the needs of our customers. We are producing tapes that can be applied to backgrinding, wafer dicing, epoxy molding, and pack
[Related Keywords : Semiconductor, DOUBLE SIDE TAPE, TAPE, LED]
Business Type
Manufacturer
Location
Gyeonggi-do, Korea
Employees Total
501 - 1000
Annual Revenue
USD 10,000,001 - 50,000,000
Min. Order:
100 Piece
Price:
US$ 0.39 ~ 0.45
Place of origin:
China
Supply Ability:
100000pcs per month
grinding, medium polishing, fine finishing) ·Polishing for magnetic heads and hard disks ·Lapping and polishing for optical glasses, optical crystal , LED ·Lapping and polishing for Semiconductor wafer (gallium arsenide, indium phosphide etc.) ·Edge polishing for silicon wafer Usage: 1.Cutting angle of fiber optic connector, rough grinding, medium grinding, fine grinding 2.Grinding and polish
[Related Keywords : Fiber polishing paper, potic polishing paper, diamond polishing paper]
Business Type
Manufacturer
Location
Guangdong, China
Employees Total
11 - 50
Annual Revenue
USD 100,000 - 500,000
Competitive semiconductor back grinding products from various semiconductor back grinding manufacturers and semiconductor back grinding suppliers are listed above, please select quality and cheap items for you.
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