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Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit coating:0.075um to 5mil Ceramic Metallized substrate: Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate: LED Al2O3 thin film substrate LED Al2O3 thick film substrate LED AlN thin film heat-dissipation substrate Flip chip substrate
The integration of the thin film,thick film,electrode plating and electroless plating processes
Application:
1. High Power LED ceramic substrate
2. Microwave (Wireless Communication & Radar)
3. Semiconductor Process Equipment
4. Solar Cell
5. Hybrid Electric Vehicles
6.Flip chip/eutectic substrate
7.Sensor ceramic substrate
For more info please checkwww.tensky.com.tw
We will very pleaseure to involve business with you. Please don't be hesitate to contact with us.
| Registration Date | 2011/09/30(Year/Month/Date) |
|---|---|
| Buyer / Seller in EC21 | Seller |
| Business Type | Manufacturer |
| Year established | 2007 |
| Employees total | 51 - 100 |
| Annual revenue | USD 100,000 - 500,000 |
| Company | TenSKy Technology Co., Ltd. |
|---|---|
| Address | No.135, Chenggong 2nd St . ,Jhubei City , Hsinchu County 302,Taiwan (R.O.C.)TaiwanHsinchu County30264Taiwan |
| Phone | 886 - 3 - 5905018 |
| Fax | 886 - 3 - 5905085 |
| Homepage | http://www.ceramicpcb.com |
| Contact | Richard Yeh |