The DCP500 ic chip making machine
can perform electrical performance testing and personalized data writing on small batches of M2M chips, automotive electronic SE (Security Element - security chips), eSIM and other smart devices in various packaging forms such as DFN, QFN, SOP, VSOP, LQFP, etc.
DCP500 can provide flexible sample card testing and small batch order production solutions for global mobile operators, smart device foundries, and automotive electronic security chip manufacturers.
Advantages of M2M ic manufacturing machine
01
High-precision chip handling mechanism, supporting the production of chips as small as 2*2mm.
02
Supports a dozen types of smart devices in packaging forms such as QFN, DFN, SOP, VSOP, LQFP, etc. Switching between different chip specifications takes only 20 minutes.
03
Fully supports secondary development to meet various customization needs.
There are many smart card manufacturers
, but we are one of the best choices for you.
