Application
The three-in-one release film combines multiple functions such as release, cushioning and support. It is widely used in the fields of electronics and electrical appliances, medical industry, automotive industry, optics, and packaging industry. In the lamination process of circuit boards, the three-in-one release film can prevent the semi-cured sheet from adhering to the steel plate, while buffering the pressure to ensure the flatness of the circuit board and the integrity of the circuit.
It is suitable for the filling and overmolding of rigid-flexible PCB during the lamination process.
Features
1.
Multifunctional integration: Integrates release, protection and support functions, simplifies operation process and improves production efficiency.
2.
Excellent release performance: The surface is specially treated to ensure moderate release force, easy peeling and no residue, suitable for precision processing scenarios.
3.
High temperature resistance: It can withstand high temperature environment (150°C~280°C), remain stable at high temperature, and does not deform or shrink.
4.
Low thermal expansion coefficient: It matches the thermal expansion coefficient of the substrate to reduce performance failure caused by deformation at high temperatures.
Customization: Can be matched with core layers of different specifications and sizes
