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Al2O3-3x3 for 5~6W (pnl:116.6x57.15mm for 36pcs) Size:12x12xt0.5mm with 0.7~0.8mm
silicon cavity Chips size: 24mil~35mil LED COB ceramic substrate
Al2O3--3x3 for 9 die and 5~6Wt used Al2O3--5x5 for 25 die and 20 Wt used AlN--7x7 for 49 die and 50Wt used AlN 10x10 for 100 die and 100Wt used Ceramic metallized:
Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit plating: 1um~150um Ceramic Metallized substrate
: Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate:
LED COB ceramic substrate LED Al2O3 thin film substrate LED Al2O3 thick film substrate LED AlN thin film heat-dissipation substrate Flip chip substrate:
The integration of the thin film,thick film,electrode plating and electroless plating processes: Application:
1. High Power LED ceramic substrate
2. Microwave (Wireless Communication & Radar)
3. Semiconductor Process Equipment
4. Solar Cell
5. Hybrid Electric Vehicles
6.Flip chip/eutectic substrate
7.Sensor ceramic substrate
For more info please checkwww.tensky.com.tw
We will very pleaseure to involve business with you. Please don't be hesitate to contact with us.
Registration Date | 2011/09/30(Year/Month/Date) |
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Buyer / Seller in EC21 | Seller |
Business Type | Manufacturer |
Year established | 2007 |
Employees total | 51 - 100 |
Annual revenue | USD 100,000 - 500,000 |
Company | TenSKy Technology Co., Ltd. |
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Address | No.135, Chenggong 2nd St . ,Jhubei City , Hsinchu County 302,Taiwan (R.O.C.)TaiwanHsinchu County30264Taiwan |
Phone | 886 - 3 - 5905018 |
Fax | 886 - 3 - 5905085 |
Homepage | http://www.ceramicpcb.com |
Contact | Richard Yeh |