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PCB Protective Film
Yingfa-Chaowei plastic PCB protective film is primarily used as a protective film for backing sheets used in printed circuit board (PCB) manufacturing. Produced using state-of-the-art adhesive coating and extrusion molding technologies, it boasts high thickness and precise adhesion, improving customer production efficiency and quality. Both the adhesive and backing layers of this film exhibit excellent transparency, without affecting optical properties during exposure. The initial adhesion after application can be fine-tuned to suit customer needs, facilitating rework. Furthermore, the film's surface features a solvent-resistant release treatment, enhancing durability and reducing the need for replacement.
Specific categories are as follows:
1. Release Film for PCB/FPC Hot Press Protection:
This release film features low outgassing and excellent embedding properties, and can withstand high-temperature hot press processes up to 190°C. It is suitable for manufacturing FPCs and rigid-flex circuit boards.
Advantages:
The film's polymer exhibits excellent thermal stability, resulting in a clean film with minimal outgassing.
High mechanical strength, including tensile strength, elongation at break, and tear strength, with minimal variability.
Low variability at high temperatures, maintaining excellent stability.
Suppresses adhesive leakage during lamination, even under high step heights.
Applications:
Release film for printed circuit board hot lamination processes (applicable to industries such as mobile phones, tablets, automotive electronics, game consoles, and hard drives).
Surface protection during lamination of substrates and prevention of CVL adhesive overflow.
2. PCB process film protection film. This product is specifically tailored to the process requirements of PCB and flexible circuit board lamination production. It features a smooth, flat surface, free of particles, bubbles, pinholes, and foreign matter. It offers excellent mechanical properties, uniform thickness tolerances, stable dimensions, low thermal shrinkage, and excellent separation performance. It is easy to tear without leaving adhesive residue, and exhibits excellent high-temperature and outgassing resistance. It is suitable for applications such as material transfer and panel protection.
Advantages:
Highly durable antistatic properties
Suppresses air bubbles during lamination
Registration Date | 2025/08/21(Year/Month/Date) |
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Buyer / Seller in EC21 | Seller |
Business Type | Manufacturer |
Year established | 2008 |
Employees total | 51 - 100 |
Annual revenue | More than 100,000,000 |
Company | Foshan Yingfa Plastic Materials Co.,Ltd |
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Address | No.16 Guinan Road , Guicheng , NanhaiFoshanGuangdongChina |
Phone | 86 - 135 - 00254524 |
Homepage | www.packagefilm.cn/ |
Contact | Zelong Richard |