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Gold plating has low contact resistance, good electrical conductivity, good weldability, corrosion resistance, so electroplating has a wide range of applications in integrated circuit manufacturing, for example: in the driver IC package commonly used electroplated gold bump; in CMOS/MEMS in the application of electroplating to make switch contacts and various structures, etc.; In the radar gold plating as an air bridge is applied; plating is also used for UBM barrier layer protection layer, and for a variety of lead bonding bonding surface and so on.
PCB plating machine line Hebei Ruisite
Model No.: RST-BDT-001
Price: US$6,000-US$200,000
Min. order quantity: 1 Set
Capacity: 5 Sets / Month
Country of origin: Hebei,China
Trade terms: FOB, CFR, CIF
Payment terms: L/C, T/T
https://www.electroplatingmachines.com/products/precision-semiconductor-gold-plating-line.html

| Registration Date | 2023/08/04(Year/Month/Date) |
|---|---|
| Buyer / Seller in EC21 | Seller |
| Business Type | Manufacturer |
| Year established | 2020 |
| Employees total | 101 - 500 |
| Annual revenue | USD 10,000,001 - 50,000,000 |
| Company | Hebei Ruisite Precision Technology Co., Ltd |
|---|---|
| Address | 607, 6/F, Building A1, Optics Valley Science Park, No. 99, Yuyuan RoadShijiazhuangHebeiChina |
| Phone | 86 - 0311 - 13933151511 |
| Homepage | www.electroplatingmachines.com/ |
| Contact | Nick Long |