Introduction:
The 30w fiber laser with optics isolation system has high stability and good scribing quality, better than traditional lamp-pumped and diode laser. Its 1,064 nm laser wavelength could scribe on silicon wafer/ solar cell/ ceramic wafer/ thin metal sheet.
Application and Market:
Scribing and cutting for mono-crystalline silicon, poly-crystalline silicon, amorphous-crystalline silicon, solar cell, Silicon.
Features:
● Great laser quality/ reliability
● Very Low operation cost
● Maintenance-free
● Compact design
● Easy operation and professional software
Advantage:
●Marble working platform and KK module from Hiwi,Taiwan keeps stable running and accuracy
●Adopt high speed and low voltage servo in avoid of breakdown from Motion structure encoder feedback wire fatigue
●Fiber focal fine-tuning design with straight in type,no need to adjust the light deviation and decrease default rate
●Auto electrical pedal with automatic inhale to improve efficiency
Technical Parameters:
Laser output: 20KHz~100KHz continuous adjustable
Laser wavelength:1,064 nm
Laser power: 30w(400mm/s)
Laser output power:10%-100% adjustable
Laser quality:M2 <1.8
Scribing speed: 400mm/s(30w)
Cutting scribing accuracy:±0.05 mm
Scribing cell size: max 210*210mm
Worktable size:220*220mm
CNC worktable accuracy: ±0.01 mm
Cooling:by air
Running temperature:15-35degree
Power supply: 1-phase 220VAC,50Hz
Dimension:950*750*1380mm
Weight:200KG
